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Company news Au PCC Wire Gains Attention as a Bridge Between Gold and Copper Bonding Technologies

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2025-12-29

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Au PCC wire is gaining industry attention as a hybrid bonding material combining gold-like bondability with copper-based cost advantages.

PreviousPrevious: Reliability Testing Expands for Au PCC Wire in Automotive and Industrial Electronics NextNext: OSATs Accelerate Evaluation of Au PCC Wire for Cost-Optimized Semiconductor Bonding

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Sichuan venal special electronic materials co., ltd.