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Application field
Weiner products are widely used in LED and IC applications
Semiconductor packaging and other fields
The company gathers the top domestic and industry technical experts,Established an enterprise technology center,Successfully developed for semiconductor separate devices、VariousICCoward's high -purity bonding copper wire;Applied toLEDLow -cost gold -plated alloy wires and special alloy silk for smart card packaging;High -endICThe single crystal plated copper wire for packaging,Bond aluminum line。
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Our patents
A surface coated palladium bonded copper wire
An alloy type bonding wire with a composite coating on its surface
A silver based bonding wire and its preparation method
Graphene composite bonding wire and its preparation method
A copper silver bonding gold wire and its preparation method, Application
Conductive guide wheel device for metal wire and electroplating production line
A high conductivity and oxygen resistant microalloyed copper alloy bonding wire and its preparation method
...
Honor
Awarded the "Demonstration Project" of Sichuan Province's Major Science and Technology Achievement Transformation Project
Awarded the title of "National High tech Enterprise"
Received the "Annual Economic Development Contribution Award"
Awarded the "Specialty" Sme title
Pass "Two Integration Management System Certification"
...
About us
Sichuan Winner Special Electronic Materials Co., Ltd. is a company specializing in precious metal smelting, Ultra fine metal silk material and surface treatment, research and development, and national high-tech enterprises produced and sold
The company passedTS16949Quality management system and systemISO14001Environmental management system certification,Can ensure online quality control and environmental protection clean production; At the same time, all products of the company have obtained the composite EU ROTHTInstructionSGS Certification; All production lines and all operating activities of the company have passed the eia review of the environmental protection bureau。
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2009 Year
Company establishment
Sichuan venal special electronic materials co., ltd.
500+
Partner
Always maintain a leading position to meet customer requirements
30+
Engineer
To create the best product for you
High standard purification plant、Advanced production and testing equipment、Strict test means
The company closely cooperates with well -known domestic universities and research institutes and research institutes,Master the market dynamics and the latest design at any time、Manufacturing technology, Make core products always maintain a leading position to meet the requirements of higher and higher customers
High standard purification plant、Advanced production and testing equipment、Strict test means
The company closely cooperates with well -known domestic universities and research institutes and research institutes,Master the market dynamics and the latest design at any time、Manufacturing technology, Make core products always maintain a leading position to meet the requirements of higher and higher customers
High standard purification plant、Advanced production and testing equipment、Strict test means
The company closely cooperates with well -known domestic universities and research institutes and research institutes,Master the market dynamics and the latest design at any time、Manufacturing technology, Make core products always maintain a leading position to meet the requirements of higher and higher customers
High standard purification plant、Advanced production and testing equipment、Strict test means
The company closely cooperates with well -known domestic universities and research institutes and research institutes,Master the market dynamics and the latest design at any time、Manufacturing technology, Make core products always maintain a leading position to meet the requirements of higher and higher customers
High standard purification plant、Advanced production and testing equipment、Strict test means
The company closely cooperates with well -known domestic universities and research institutes and research institutes,Master the market dynamics and the latest design at any time、Manufacturing technology, Make core products always maintain a leading position to meet the requirements of higher and higher customers
High standard purification plant、Advanced production and testing equipment、Strict test means
The company closely cooperates with well -known domestic universities and research institutes and research institutes,Master the market dynamics and the latest design at any time、Manufacturing technology, Make core products always maintain a leading position to meet the requirements of higher and higher customers
Imported melting furnaces from Japan
Smelting furnace imported from Japan
Imported wire drawing machine from Japan
Wire drawing machine imported from Japan
Ultra fine metal electroplating production line
Ultra-fine metal plating production line
Advanced vertical and horizontal annealing furnace
Advanced vertical and horizontal annealing furnace
ICP chemical analyzer
ICP Chemistry Analyzer
Tensile Tester
Tensile tester
Latest news
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China Imposes New Licensing Rules on Tungsten Exports
SEMICON / FPD China
2025-08-13
Gold-Plated Molybdenum Wire Market to Reach $450M by 2032 with 6.5% CAGR
SEMICON / FPD China
2025-08-11
Gold-Plated Metal Fine Wire Market Surges with Medical & Aerospace Demand
SEMICON / FPD China
2025-08-08
Electronics Bonding Wire Market Set to Reach $17.3 Billion by 2031
SEMICON / FPD China
2025-08-07
Global Ultrafine Tungsten Wire Market to Grow ~7% CAGR Through 2032
SEMICON / FPD China
2025-08-06
WINNER Expands Production Capacity to Meet Growing Demand in Aerospace and EV Sectors
SEMICON / FPD China
2025-08-05
The Functional Value of the Gold Layer in Ultra‑Fine Gold‑Plated Tungsten Wire
SEMICON / FPD China
2025-08-04
0.01 mm Ultra‑Fine Gold‑Plated Tungsten Wire — High‑Temperature Stable and Precision‑Engineered
SEMICON / FPD China
2025-08-01
Winner’s Advanced Bonding Wire Solutions Powering High‑Tech Packaging
SEMICON / FPD China
2025-07-31
Winner Achieves Major Advance in Continuous Gold Electroplating of Ultrafine Molybdenum Wire
SEMICON / FPD China
2025-07-30
Tungsten at the Forefront: Precision, Strength, and Reliability in Semiconductor Applications
SEMICON / FPD China
2025-07-28
Next‑Gen Semiconductor Bonding: Copper Leads the Way in Efficiency and Durability
SEMICON / FPD China
2025-07-25
Palladium-plated Wire Source Factory, Supplier
SEMICON / FPD China
2025-06-13
Sichuan Winner electroplating factory
SEMICON / FPD China
2025-06-13
Tungsten wire processing, tungsten wire source factory tungsten wire manufacturer
SEMICON / FPD China
2025-06-13
Bonding copper wire source factory#supplier
SEMICON / FPD China
2025-06-13
Molybdenum wire source factory, gold-plated molybdenum wire supplier
SEMICON / FPD China
2025-06-13
Application of pure copper wire in medical devices
SEMICON / FPD China
2025-06-06
Application of Beryllium Copper Wire in Medical Devices
SEMICON / FPD China
2025-06-06
Application of tungsten wire in medical surgery
SEMICON / FPD China
2025-06-06
Application of molybdenum wire in medical devices
SEMICON / FPD China
2025-06-06
Application of gold-plated tungsten wire in medical field
SEMICON / FPD China
2025-06-06
Factory Application of Gold-plated Silver Bonding Wire
SEMICON / FPD China
2025-05-29
Application of gold-plated silver bonding wire
SEMICON / FPD China
2025-05-29
Application of gold-plated bonding wire
SEMICON / FPD China
2025-05-29
Advanced Packaging II — A review of applications from Intel, TSMC, Samsung, AMD, ASE, Sony, Micron, SKHynix, Yangtze Memory Technologies, and Nvidia
SEMICON / FPD China
2025-05-29
Preparation and processing of tungsten
SEMICON / FPD China
2025-05-23
Chemical Properties of Tungsten
SEMICON / FPD China
2025-05-23
Physical Properties of Molybdenum
SEMICON / FPD China
2025-05-23
Chemical properties of molybdenum
SEMICON / FPD China
2025-05-23
Tungsten wire electroplating manufacturers
SEMICON / FPD China
2025-05-23
Four bonding methods in chip packaging
SEMICON / FPD China
2025-04-30
Research progress on high-density system-level packaging technology and reliability
SEMICON / FPD China
2025-04-30
Semiconductor chip manufacturing technology
SEMICON / FPD China
2025-04-30
Chip manufacturing technology bonding technology
SEMICON / FPD China
2025-04-30
Key points and process control of bonding wire production
SEMICON / FPD China
2025-04-30
Gold-plated tungsten wire medical grade product application
SEMICON / FPD China
2025-04-25
Product Application of Molybdenum Wire
SEMICON / FPD China
2025-04-25
Aerospace grade gold-plated molybdenum wire
SEMICON / FPD China
2025-04-25
About bonding wire
SEMICON / FPD China
2025-04-25
Palladium plated wire
SEMICON / FPD China
2025-04-25
High purity copper wire
SEMICON / FPD China
2025-04-18
bonding gold wire
SEMICON / FPD China
2025-04-18
Main applications of gold plated tungsten wire
SEMICON / FPD China
2024-11-24
Sichuan Weiner Special Electronic Materials Co., Ltd. has achieved a technological breakthrough in the ultrafine molybdenum wire electroplating process
SEMICON / FPD China
2024-10-25
2023 China International Cable and Wire Exhibition
SEMICON / FPD China
2024-10-25
Leaders from the Russian Federation of Trade Unions and the National Space Agency visited our company for inspection
SEMICON / FPD China
2024-10-25
Sichuan Weiner Special Electronic Materials Co., Ltd. Semiconductor Integrated Circuit Ultra fine Electroplating Bond Wire Diversified Transformation Project Environmental Impact Assessment Public Participation Online First Publicity
SEMICON / FPD China
2024-10-25
Cross border Global · Heart to Heart Connection - SEMICON/FPD China 2024 is about to grandly open
SEMICON / FPD China
2024-10-25
The semiconductor industry is competing to expand its packaging business
SEMICON / FPD China
2024-10-25
Conflict Mineral Policy
SEMICON / FPD China
2024-10-25